发明名称 CONNECTING STRUCTURE FOR METAL SUBSTRATE, LED MODULE HAVING THE SAME AND CONNECTING METHOD FOR METAL SUBSTRATE
摘要 PURPOSE: A metallic board connection structure, a light-emitting diode module including the same, and a metallic board connecting method are provided to improve soldering quality of a wire by preventing heat to be transmitted to a metallic board when soldering the wire. CONSTITUTION: A metallic board(10) is composed of material including metal. A connection terminal which is electrically connected with outside is formed on the metallic board. A connection board(20) electrically interlinks the connection terminal of the metallic board and a wire(30). The connection board is composed of material in which heat conductivity is higher than the metallic board. The wire supplies electricity to a light-emitting diode device(15). A soldering pad(25) is formed at one side of the connection board. The soldering pad is exposed to outside.
申请公布号 KR101168068(B1) 申请公布日期 2012.07.24
申请号 KR20110017386 申请日期 2011.02.25
申请人 ICEPIPE CORPORATION 发明人 I, SANG CHEOL
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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