| 摘要 |
A substrate for high frequency includes: a dielectric substrate; a transmission line which is formed on a front surface of the dielectric substrate and includes land portions opposite to each other with a gap therebetween; a grounded conductor which is formed on a rear surface of the dielectric substrate and includes an opening portion in a region corresponding to the land portions; and a metal substrate on which the dielectric substrate is disposed in a state where the grounded conductor is in contact with the metal substrate, and also, a through hole is formed at a portion corresponding to the opening portion. |
