METHOD FOR THE SELECTIVE METALLIZATION OF A SUBSTRATE AND A CIRCUIT CARRIER PRODUCED ACCORDING TO THIS METHOD

摘要

PURPOSE: A selective substrate metalizing method and a circuit carrier produced by the same method are provided to sediment palladium by opening the pore of the pore structure of aluminosilicate or securing the accessibility for the aluminosilicate. CONSTITUTION: A selective substrate metalizing method is as follows. A layer close to the surface of substrate is removed through an ablation method. The substrate comprises a material portion made of plastic. The plastic includes one of aluminosilicates and tectoaluminosilicates. The metal is precipitated at an outer edge region of the pore for forming a flat metalized layer on the surface of the substrate.