发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A substrate processing apparatus is provided to uniformly process a substrate by making the flow of gas uniform. CONSTITUTION: A substrate is loaded on a substrate loading stand. A baffle substrate(60) is installed in around the substrate loading stand in order to divide the interior of a process chamber into a process space and an exhaust space. An exhaust pipe(5) exhausts the interior of the process chamber. The exhaust pipe is arranged on the bottom of the process chamber. A gap(62) is formed between the substrate loading stand and the baffle substrate. A plurality of through holes(65) connecting the process space and the exhaust space is formed on the baffle substrate.</p>
申请公布号 KR20120082369(A) 申请公布日期 2012.07.23
申请号 KR20120003992 申请日期 2012.01.12
申请人 TOKYO ELECTRON LIMITED 发明人 ODAGIRI MASAYA;TOZAWA SHIGEKI;UGAJIN HAJIME
分类号 H01L21/3065 主分类号 H01L21/3065
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