NOVEL PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce the thickness of a printed circuit board by applying a coreless structure without a copper foil laminate. CONSTITUTION: A top conductive circuit pattern unit(210) is located on the upper side of an insulation base unit(201). A bottom conductive circuit pattern unit(220) is located on the lower side of the insulation base unit. A through hole(260) electrically connects the top conductive circuit pattern unit and the bottom conductive circuit pattern unit. An insulation member for laminate is successively laminated on the upper and lower sides of a conductive separation member. A conductive layer is successively laminated on the upper and lower sides of the insulation member for the laminate.