ADHESIVE TAPE FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

PURPOSE: An adhesive tape for preparing electronic components is provided not to remain adhesive on the surface of a lead frame and a sealing resin, and to satisfy all required properties for semiconductor device manufacturing process. CONSTITUTION: An adhesive tape for preparing electronic components comprises an adhesive layer, a layer not having adhesion, spread on the adhesive layer. The adhesive layer and a layer not having adhesion consist of a phenoxy resin, a heat curing agent, a curable acrylic resin, and a photo initiator. The composition ratio of the adhesive layer, and a layer not having adhesive layer are different each other. The weight average molecular weight of the phenoxy resin is 1,000-500,000. The adhesive layer and the layer not having adhesion is 80-150 °C.