发明名称 |
TELECOMMUNICATION CONNECTOR AND PLATING METHOD FOR TELECOMMUNICATION CONNECTOR |
摘要 |
PURPOSE: A communication connector and a surface treatment method thereof are provided to prevent the performance of the communication connector from decreasing by offering a plating layer having PIMD(Passive Intermodulation Distortion) and high corrosion resistance. CONSTITUTION: A method for treating a surface of a communication connector is as follows. The surface(10) of the communication connector is plated with a priming coat layer(20) made of copper cyanide. An upper part of the priming coat layer is plated with zinc-nickel alloy, and a surface plated layer(30) is formed. The zinc-nickel alloy contains 60~74wt% zinc and 60~74wt% nickel.
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申请公布号 |
KR20120082228(A) |
申请公布日期 |
2012.07.23 |
申请号 |
KR20110003605 |
申请日期 |
2011.01.13 |
申请人 |
TELCON;MUN, YONG HWAN |
发明人 |
IM, JIN HUN;OH, JEONG KWAN;MOON, YONG HWAN;NOH, BYOUNG HO |
分类号 |
C23C18/50;C23C18/52;H01R12/51 |
主分类号 |
C23C18/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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