发明名称 TELECOMMUNICATION CONNECTOR AND PLATING METHOD FOR TELECOMMUNICATION CONNECTOR
摘要 PURPOSE: A communication connector and a surface treatment method thereof are provided to prevent the performance of the communication connector from decreasing by offering a plating layer having PIMD(Passive Intermodulation Distortion) and high corrosion resistance. CONSTITUTION: A method for treating a surface of a communication connector is as follows. The surface(10) of the communication connector is plated with a priming coat layer(20) made of copper cyanide. An upper part of the priming coat layer is plated with zinc-nickel alloy, and a surface plated layer(30) is formed. The zinc-nickel alloy contains 60~74wt% zinc and 60~74wt% nickel.
申请公布号 KR20120082228(A) 申请公布日期 2012.07.23
申请号 KR20110003605 申请日期 2011.01.13
申请人 TELCON;MUN, YONG HWAN 发明人 IM, JIN HUN;OH, JEONG KWAN;MOON, YONG HWAN;NOH, BYOUNG HO
分类号 C23C18/50;C23C18/52;H01R12/51 主分类号 C23C18/50
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