| 摘要 |
PURPOSE: A wafer level light emitting device package and a manufacturing method thereof are provided to enhance photonic efficiency by forming an electrode at the lower side of the light emitting device package without using a wire. CONSTITUTION: An electrode pad(20) is prepared at one side which is opposite to the side in which light is emitted from a light emitting structure. A polymer layer(30) is prepared at the one side in order to cover the electrode pad and the light emitting structure. The polymer layer comprises a first via hole formed on the area corresponding to the electrode pad. A package substrate is located on the polymer layer and comprises a second via hole corresponding to the first via hole. An electrode(70) is prepared in the first via hole and the second via hole and is connected with the electrode pad. |
