METHOD FOR METAL PATTERNING AND SUBSTRATE FOR FORMING PATTERNED METAL FILM
摘要
<p>PURPOSE: A method for patterning metal and a substrate for forming a patterned metal layer are provided to form the patterned metal layer on the substrate by using surface treatment compositions including polymers and reducing agents. CONSTITUTION: Surface treatment compositions(20) are patterned on the surface of a substrate(10) and include polymers and reducing agents. The surface treatment compositions are patterned with a line width of 5 to 20 um. The polymer is selected among hydrophilic polymer, hydrophobic polymer, and amphiphilic polymer. A patterned metal layer(40) is formed by coating the surface of the substrate with a metal supply source(30).</p>
申请公布号
KR20120081754(A)
申请公布日期
2012.07.20
申请号
KR20110003057
申请日期
2011.01.12
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, SUK JUN;BYUN, YOUNG HUN;LEE, JAE HO;CHOI, YUN HYUK