LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve reliability by minimizing an unfilled domain in a package body. CONSTITUTION: A first lead frame(102a) and a second lead frame(102b) are combined with a package body(101). A light emitting device is arranged on either the first lead frame or the second lead frame. The light emitting device is electrically connected with the first lead frame or the second lead frame. A first gate trace(104a) is formed into a groove shape and is located on the location which is separated from a line between the first lead frame or the second lead frame. A second gate trace(104b) is formed into a groove shape and is arranged on the line between the first lead frame and the second lead frame.