| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor device and an electronic component that can suppress temperature rise accompanied by heat generation of a semiconductor device and an electronic component having large power consumption and can operate them stably. <P>SOLUTION: A mounting structure for a semiconductor device and an electronic component comprises: an interposer 10; a semiconductor device 11 mounted on a surface 10a of the interposer 10; and a cover 12 that is closely-attached and fixed to the surface 10a of the interposer 10 so as to include the semiconductor device 11, and forms an internal space S with the interposer 10. The cover 12 has an inlet 13 introducing fluid L absorbing heat into the internal space S from the outside and an outlet 14 ejecting the fluid L from the internal space S to the outside. The internal space S is a closed space except for the inlet 13 and the outlet 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
