发明名称 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To easily individually adjust the shape and the size of spots of laser beams to be used concurrently. <P>SOLUTION: The laser beam &lambda;a forms an image by a lens 120a at the image-forming position P1a, then is collimated by a lens 121a, and enters a dual-wavelength mirror 123. The laser beam &lambda;b forms an image by a lens 120b at the image-forming position P1b, and is collimated by a lens 121b, reflected by a total reflection mirror 122, and enters the dual-wavelength mirror 123. The optical paths of the laser beam &lambda;a and the refrigerant &lambda;b are coupled with each other by the dual-wavelength mirror 123, and the image formation is performed at the image-forming position P2 by a dual-wavelength lens 124. The present invention is applicable to, for example, a laser beam machining apparatus for machining a thin film solar battery panel. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012135807(A) 申请公布日期 2012.07.19
申请号 JP20100291336 申请日期 2010.12.27
申请人 OMRON CORP 发明人 KUDOKORO YUKIO;SUZUKI YOSHIKAZU
分类号 B23K26/073;B23K26/00;B23K26/04;B23K26/06;B23K26/08;H01S3/00 主分类号 B23K26/073
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