发明名称 MULTILAYER WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is interlayer connected by veer hole conductors having high reliability in electrical connection, thereby meeting a need of Pb free. <P>SOLUTION: A multilayer wiring board comprises insulation resin layers, wiring lines provided on both surfaces of the insulation resin layer, respectively, and veer hole conductors for electrically connecting the wiring lines. The veer hole conductor includes a metal portion and a resin portion. The metal portion includes a first metal region containing a binding body of copper particles connecting wiring lines, a second metal region containing tin, a tin-copper alloy, a tin-copper intermetallic compound and the like as major components, and a third metal region containing bismuth as a major component. When copper particles forming the binding body are brought into surface contact, a surface contact part is formed. At least a part of the second metal region contacts the first metal region. The insulation resin layer includes a thermosetting resin and an inorganic filler. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012138417(A) 申请公布日期 2012.07.19
申请号 JP20100288447 申请日期 2010.12.24
申请人 PANASONIC CORP 发明人 ISHITOMI HIROYUKI;HIRAI SHOGO;HIMORI GOJI;HIGUCHI TAKAYUKI
分类号 H05K3/46;H05K1/09 主分类号 H05K3/46
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