| 摘要 |
<p>A method for manufacturing a laminated board, comprising: preparing a first and a second prepregs 30a, 30b with a carrier by laminating the carrier with an insulating resin layer in which a fiber cloth is embedded, and laminating the first and the second prepregs 30a, 30b with a carrier by bonding the insulating resin layer in the first prepreg 31a with a carrier and the insulating resin layer in the second prepreg 31b with a carrier directly or via an additional member under reduced pressure and heating it.</p> |
