发明名称 COOLER SOLDERING STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooler soldering structure capable of reliably soldering a cooler. <P>SOLUTION: A soldering structure comprises a concave bottom plate 40, a pipe 30 fitted with the concave, and a top plate 20 soldered to the bottom plate 40 and the pipe 30 and sealing a concave part 41. A coolant flows in the pipe 30, and a projection part 33 with width larger than that of the concave part on a cross section crossing with a flowing direction of the coolant 30 is formed on the pipe 30. The projection part 33 is interposed between the top plate 20 and the bottom plate 40, and the projection part 33 enters a gap between the top plate 20 and the bottom plate 40. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012138395(A) 申请公布日期 2012.07.19
申请号 JP20100287879 申请日期 2010.12.24
申请人 TOYOTA MOTOR CORP 发明人 NAKAJIMA MASARU
分类号 H01L23/473 主分类号 H01L23/473
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