| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide both smoothness (linearity) of the cleavage plane of an individualized wafer chip and prevention of adhesion of rubbish of the pressure sensitive adhesive to the chip when individualizing a wafer by cleavage. <P>SOLUTION: The pressure sensitive adhesive sheet 10 for sticking to a wafer, that is used when individualizing a wafer by cleavage, comprises a base material sheet 11, that is composed of the first layer 111 comprised of an amorphous resin having rubber-like properties and the second layer 112 located on the side of the adhesive layer of the first layer, and the thickness of the first layer is made 55% or more than that of the base material sheet. <P>COPYRIGHT: (C)2012,JPO&INPIT |
