| 摘要 |
<P>PROBLEM TO BE SOLVED: To transfer two wafers simultaneously with one end effector. <P>SOLUTION: The end effector with a holding mechanism for holding a wafer is provided with: on the top surface thereof, a first holding mechanism driven by a first driving mechanism for holding a wafer; and on the backside thereof, a second holding mechanism driven by a second driving mechanism for holding a wafer. This configuration can hold wafers both on the top surface and the backside of the end effector at the same time. <P>COPYRIGHT: (C)2012,JPO&INPIT |
