| 摘要 |
<p>An apparatus and method for etching a portion of a wafer include a mount for holding a wafer having an edge, a front surface, a back surface and an axis perpendicular to the front and back surfaces. A frame is used to deliver an etchant to the wafer edge while the wafer is held with the wafer edge at a distance from the frame. A nonreactive fluid flow may be provided and directed along the front and back surfaces of the wafer edge to drive the etchant away from the front and back surfaces. The frame can be configured either to deliver the etchant in liquid form or to deliver the etchant in vapor form. The frame can include a plenum for directing the etchant in vapor form to the wafer edge within a receiving area of the plenum, or the frame can include a roller having a groove for receiving the wafer edge and for drawing the etchant in liquid form to the wafer edge.</p> |
