发明名称 THERMALLY EXPANDABLE MICROSPHERE AND APPLICATION OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally expandable microsphere and application of the same whose heat resistance is high and whose expansion starting temperature falls when heat treatment is conducted at temperature below the expansion starting temperature. <P>SOLUTION: The thermally expandable microsphere includes a shell composed of a thermoplastic resin and a foaming agent to be involved in the shell and evaporated by being heated. In the thermally expandable microsphere, the thermoplastic resin is constituted of a copolymer obtained by polymerizing a polymerizable component containing a carboxyl group-containing monomer, a crosslinking structure is formed by a metal in the neighborhood of the surface of the shell, and the foaming agent necessitates a &ge;12C hydrocarbon (a). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012136695(A) 申请公布日期 2012.07.19
申请号 JP20110264568 申请日期 2011.12.02
申请人 MATSUMOTO YUSHI SEIYAKU CO LTD 发明人 KITA YU;MIKI KATSUSHI
分类号 C08F8/00;B01J13/04;C08J9/32 主分类号 C08F8/00
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