| 摘要 |
<P>PROBLEM TO BE SOLVED: To excellently fill a resin material between laminated semiconductor chips to prevent the resin material from covering a bump electrode of the semiconductor chip thereby improve operational reliability of a semiconductor device. <P>SOLUTION: A method comprises a lamination step of laminating an interface chip 12b smaller than one face of a memory chip 12a in area on the one face of the memory chip 12a and a filling step of supplying a first encapsulation resin material 16 to a periphery of the memory chip 12a to fill the first encapsulation resin material 16 between the memory chip 12a and the interface chip 12b. In the filling step, the first encapsulation material 16 is wet spread along a wet spreading promotion film 15 formed on the one face of the memory chip 12a and extending from one end of the periphery of the memory chip 12a to a region on which the interface chip 12b is to be laminated, and subsequently, the first encapsulation resin material 16 is filled between the memory chip 12a and the interface chip 12b depending on a capillarity force. <P>COPYRIGHT: (C)2012,JPO&INPIT |
