发明名称 |
TRENCH IMPLANTATION METHOD AND FILM FORMING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a trench implantation method capable of forming an expandable film and a film which serves as an oxidation barrier inside a trench in spite of further progress of microfabrication. <P>SOLUTION: A trench implantation method includes: a step (step 3) of forming an oxidation barrier film inside a trench; a step (step 4) of forming an expandable film on the oxidation barrier film; a step (step 5) of implanting the trench with an implantation material which shrinks due to burning; and a step (step 6) of burning the implantation material. The step 3 further includes a step (step 31) of forming a first seed layer inside the trench by supplying an aminosilane-based gas and a step (step 32) of forming a silicon nitride film on the first seed layer. The step 4 further includes a step (41) of forming a second seed layer on the silicon nitride film by supplying the aminosilane-based gas, and a step (step 42) of forming a silicon film on the second seed layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012138501(A) |
申请公布日期 |
2012.07.19 |
申请号 |
JP20100290647 |
申请日期 |
2010.12.27 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
WATANABE MASAHISA;OKADA MITSUHIRO |
分类号 |
H01L21/76;H01L21/31;H01L21/316;H01L21/318 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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