| 摘要 |
A package includes at least a chip encapsulated by an encapsulant. Conductive bumps are disposed on a first surface of the chip, for a circuit board to be disposed thereon. A phosphor layer is formed on a second surface of the chip opposing the first surface. The package further comprises a light-pervious mask that covers the phosphor layer. Since the phosphor layer and the light-pervious mask are directly formed on the chip, the chip is prevented from being disposed in the groove of the substrate. As a result, the wet etching process is omitted, and the fabrication cost is reduced. A method of fabricating the package is also provided.
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