METHOD OF BONDING MEMBER TO SUPPORT BY ADDITION OF MATERIAL, AND DEVICE FOR ARRANGING TWO ELEMENTS ONE ON TOP OF ANOTHER

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method which improves quality of a bonded part between a chip and a holder formed by cooling of a mass forming solder.

SOLUTION: The method includes a step of heating a mass 16 forming a solder and a step of arranging a mass and a member 12 on a support 14 before the heating step. In particular, the method includes a step of positioning the mass on the support, and a step of applying a frist compressive force F1 to the mass so as to compress the mass against the support. The strength of the first force F1 increases up to a first predetermined value chosen so as to flatten the mass. Subsequently, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive power F2 to the member so as to compress the member against the flattened mass and the support. The strength of the second force F2 increases up to a second predetermined value. The second predetermined value is lower than the first predetermined value.

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