| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition for a pressure-sensitive adhesive sheet for dicing that permits picking-up of a semiconductor chip and the like well by little pushing-up and to provide a pressure-sensitive adhesive sheet using the same. <P>SOLUTION: The radiation-curable pressure-sensitive adhesive composition comprises as a main raw material at least a base polymer having structural units derived from a monomer A bearing a functional group (a), a monomer B consisting of a methacrylate monomer having a 10C-17C alkyl group and a monomer C bearing both a functional group c capable of reacting with the functional group (a) and a polymerizable carbon-carbon double bond group, where the base polymer has a main chain composed of the monomer B together with the monomer A, the ratio of the monomer B being at least 50 wt.% based on all of the monomers constituting the main chain, and a side chain bearing a polymerizable carbon-carbon double bond group introduced by a reaction of a part of the functional group (a) in the monomer A with the functional group c in the monomer C to bond to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
