FAILURE ANALYSIS METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To analyze failure of a semiconductor using differential image analysis in a short time efficiently with high precision.

SOLUTION: Sweeping of a test pattern is started for a non-defective and defective semiconductor sample to obtain an emission image by a microscope. A reaction box that surrounds the obtained emission image is set and transformed into positional data of a layout coordinate system. An area where the reaction box of the non-defective sample overlaps with that of the defective sample is calculated. The reaction box whose overlapped area is smaller than a threshold value is determined to be a difference box. The difference box is displayed on an emission analysis controller.

COPYRIGHT: (C)2012,JPO&INPIT