| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conducting path shield structure capable of reducing costs while avoiding electric corrosion. <P>SOLUTION: A shield structure is realized using a shield member 25 for collectively surrounding a pair of insulation wire cores 23 and a copper wire 24. The surrounding-type shield member 25 includes an aluminum foil 31, a plating layer 32 provided on one face of the aluminum foil 31 and in contact with an outer periphery of the copper wire 24, and an insulative resin base material 33 provided on the other face of the aluminum foil 31. The surrounding-type shield member 25 which collectively surrounds the pair of insulation wire cores 23 and the copper wire 24 is protected by a surrounding-type protective member 26. <P>COPYRIGHT: (C)2012,JPO&INPIT |
