| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating substrate with a low price, excellent heat dissipation and reduced man hours for manufacture, which resolves difficulties of conventional semiconductor elements where etching time increases and processing accuracy decreases if a circuit pattern on an insulating substrate is made thicker to dissipate heat generated by the semiconductor elements. <P>SOLUTION: On a circuit pattern formed on an insulating layer, a metal block is placed via a solder sheet or beforehand soldered. Then, top and side faces of the metal block are directly coated with a metallic material to form an overlying circuit pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
