| 发明名称 |
BULK SILICON MOVING MEMBER WITH DIMPLE |
| 摘要 |
A method for forming a semiconductor device includes forming a substrate, forming a moveable member of bulk silicon and forming a first dimple structure on a first surface of the moveable member, where the first surface faces the substrate.
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| 申请公布号 |
US2012181637(A1) |
申请公布日期 |
2012.07.19 |
| 申请号 |
US201113006239 |
申请日期 |
2011.01.13 |
| 申请人 |
SHU CHIA-PAO;CHU CHIA-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SHU CHIA-PAO;CHU CHIA-HUA |
| 分类号 |
H01L29/84;H01L21/02 |
主分类号 |
H01L29/84 |
| 代理机构 |
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代理人 |
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| 主权项 |
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