发明名称 Ground and Power Mesh in an Integrated Circuit Chip
摘要 A chip device with a number of individually powered parts, such as photoreceptors. A mesh is provided to provide power to the individual photoreceptors. The mesh may be provided for ground and power and/or both. The mesh may be on different layers, so that one portion of the mesh is exactly over the other portion of the mesh. The mesh takes up a portion of real estate on the chip in between the individual photoreceptors, in locations where image sensing parts cannot be located. In an embodiment, the mesh can be intentionally broken at various locations to optimize the path length.
申请公布号 US2012181649(A1) 申请公布日期 2012.07.19
申请号 US201213435457 申请日期 2012.03.30
申请人 ANG LIN PING;HUANG STEVEN;FORZA SILICON 发明人 ANG LIN PING;HUANG STEVEN
分类号 H01L31/02 主分类号 H01L31/02
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