发明名称 POLISHING LIQUID COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition in which scratches and/or waviness on the substrate after polishing can be reduced without impairing productivity, and to provide a method for manufacturing and polishing a substrate using the same. <P>SOLUTION: The polishing liquid composition contains an abrasive, a water-soluble polymer, and water, wherein the water-soluble polymer has a sulfonic acid group, and has an aromatic ring in each of a main chain and a side chain. The method for manufacturing a substrate, and the method for polishing a substrate, include performing polishing by supplying the polishing liquid composition to a surface to be polished of a substrate to be polished, bringing a polishing pad into contact with the surface to be polished, and moving the polishing pad and/or the substrate to be polished. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012135863(A) 申请公布日期 2012.07.19
申请号 JP20110204409 申请日期 2011.09.20
申请人 KAO CORP 发明人 YOSHINO TAIKI
分类号 B24B37/00;C09K3/14;G11B5/84 主分类号 B24B37/00
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