| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-curable pressure-sensitive adhesive composition that permits ready peeling from an adherend with a lower irradiation amount and minimizes the transferred contamination amount to the adherend after peeling and to provide a pressure-sensitive adhesive sheet using the same. <P>SOLUTION: The radiation-curable pressure-sensitive adhesive composition comprises a base polymer containing a structural unit derived from at least one monomer bearing a polymerizable carbon-carbon double bond group selected from between an acryloyl group and a methacryloyl group, where the composition further contains a group contributing radiation curing that has the same polymerizable carbon-carbon double bond group as the monomer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
