发明名称 |
METAL-PASSIVATING CMP COMPOSITIONS AND METHODS |
摘要 |
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed. |
申请公布号 |
WO2012096931(A2) |
申请公布日期 |
2012.07.19 |
申请号 |
WO2012US20737 |
申请日期 |
2012.01.10 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
KELEHER, JASON;SINGH, PANKAJ;BRUSIC, VLASTA |
分类号 |
C09K3/14 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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