发明名称 |
FULLY DEPLETED SOI DEVICE WITH BURIED DOPED LAYER |
摘要 |
The present invention relates to a method for the manufacture of a semiconductor device by providing a first substrate; providing a doped layer in a surface region of the first substrate; providing a buried oxide layer on the doped layer; providing a semiconductor layer on the buried oxide layer to obtain a semiconductor-on-insulator (SeOI) wafer; removing the buried oxide layer and the semiconductor layer from a first region of the SeOI wafer while maintaining the buried oxide layer and the semiconductor layer in a second region of the SeOI wafer; providing an upper transistor in the second region by forming a back gate in or by the doped layer; and providing a lower transistor in the first region by forming source and drain regions in or by the doped layer. |
申请公布号 |
US2012181609(A1) |
申请公布日期 |
2012.07.19 |
申请号 |
US201113305206 |
申请日期 |
2011.11.28 |
申请人 |
ENDERS GERHARD;HOENLEIN WOLFGANG;HOFMAN FRANZ;MAZURE CARLOS |
发明人 |
ENDERS GERHARD;HOENLEIN WOLFGANG;HOFMAN FRANZ;MAZURE CARLOS |
分类号 |
H01L27/088;H01L21/8238;H01L29/36 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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