发明名称 CUTTING METHOD FOR STRENGTHENED GLASS PLATE
摘要 <p>A cutting method for a strengthened glass plate, having a step that irradiates a laser light (20) on the surface (12) of the strengthened glass plate (10) and moves the irradiation area (22) for the laser light (20) on top of the surface (12) of the strengthened glass plate (10), and which cuts the strengthened glass plate (10) by causing a crack penetrating the strengthened glass plate (10) in the plate thickness direction to follow behind the irradiation area (22). By irradiating the laser light (20) on the surface (12) of the strengthened glass plate (10), an intermediate layer (17) in the irradiation area (22) is heated at an annealing point temperature max., a tensile stress or a compression stress smaller than the value for the internal residual tensile stress is formed in the intermediate layer (17) in the center of the irradiation area (22), and the extension of the crack is restrained.</p>
申请公布号 WO2012096285(A1) 申请公布日期 2012.07.19
申请号 WO2012JP50335 申请日期 2012.01.11
申请人 ASAHI GLASS COMPANY, LIMITED;SAITO, ISAO;KOIKE, AKIO;IWANAGA, YASUNARI;KOBAYASHI, YUSUKE;IWASAKI, TATSUYA 发明人 SAITO, ISAO;KOIKE, AKIO;IWANAGA, YASUNARI;KOBAYASHI, YUSUKE;IWASAKI, TATSUYA
分类号 C03B33/09;B23K26/00;B23K26/14;B23K26/38 主分类号 C03B33/09
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