发明名称 COIL BUILT-IN SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a coil built-in substrate which prevents an unnecessary flux leakage to the outside and inhibits noise injection to a conductor such as wiring formed inside or on an outside surface of a substrate. <P>SOLUTION: A coil built-in substrate 101 comprises a coil conductor formation layer 20 and non-magnetic material layers 31, 32. The coil conductor formation layer 20 is a magnetic material layer in which a coil conductor 9 and a magnetic material are laminated. The non-magnetic material layer 31 is formed on an electronic component mounted surface side (first principal surface side) and includes a surface conductor film 7. The non-magnetic material layer 32 is formed on a mounting surface side (second principal surface side) with respect to a wiring board that is a mounting destination and includes the surface conductor film 7. Between the coil conductor formation layer 20 and the non-magnetic material layer 31, a magnetic material layer 41 having high magnetic permeability is provided. In addition, between the coil conductor formation layer 20 and the non-magnetic material layer 32, a magnetic material layer 42 having high magnetic permeability is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012138496(A) 申请公布日期 2012.07.19
申请号 JP20100290503 申请日期 2010.12.27
申请人 MURATA MFG CO LTD 发明人 YAZAKI HIROKAZU
分类号 H05K3/46;H05K1/16 主分类号 H05K3/46
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