| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure capable of achieving an easy identification of a defective portion, to provide a semiconductor device, and to provide a method of identifying a defective portion. <P>SOLUTION: A wiring structure comprises first wiring 14 formed above a substrate 10, and second wiring 20 that is formed above the first wiring and overlaps the first wiring in a first region. The first wiring has first tabs 16 protruding outside the first region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
