发明名称 |
BUMPED SEMICONDUCTOR WAFER OR DIE LEVEL ELECTRICAL INTERCONNECT |
摘要 |
A probe assembly that acts as a temporary interconnect between terminals on an IC device and a test station. The probe assembly includes a plurality of stud bumps arranged on a first surface of a substrate in a configuration corresponding to the terminal on the IC device. The stud bumps include a shape adapted to temporarily couple with the terminals on the IC device. A plurality of conductive traces on the substrate electrically couple the stud bumps with the test station. |
申请公布号 |
US2012182035(A1) |
申请公布日期 |
2012.07.19 |
申请号 |
US201213413032 |
申请日期 |
2012.03.06 |
申请人 |
RATHBURN JAMES;HSIO TECHNOLOGIES, LLC |
发明人 |
RATHBURN JAMES |
分类号 |
G01R31/20 |
主分类号 |
G01R31/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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