| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of a flexible wiring board in which gold plating is performed after forming a protective film, and a polyimide siloxane resin composition having improved gold-plating resistance is used suitably. <P>SOLUTION: In the mounting method of a flexible wiring board including a step for gold-plating a wiring pattern not covered with a protective film but exposed, a polyimide siloxane resin composition is composed to contain at least (A) a polyimide siloxane resin having a substituent group (carboxyl group and/or hydroxyl group) and (B) a hardener containing an epoxy resin as an essential component. The ratio of the epoxy group in the hardener (B) to the substituent group in the polyimide siloxane resin (A) ([quantity of the epoxy group]/[quantity of the substituent group]) is 1.5 or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
