| 摘要 |
<p>Provided is a semiconductor device wherein efficient cooling of an element unit and size reduction of the device are both achieved. The semiconductor device is provided with a supporting member (50) that has: a capacitor housing chamber (51a) having a capacitor (20) housed therein; and a substrate fixing section (52), which is provided on the opposite side to the cooler (40) side with respect to the capacitor housing chamber (51a), and which has a control board (30) fixed thereto. The capacitor (20) has two parallel flat surfaces (23) that are parallel to each other, and the capacitor housing chamber (51a) is provided with the parallel facing surface (51c), which is disposed parallel to the element unit disposing surface (41), and which faces the element unit disposing surface (41). Furthermore, the capacitor housing chamber houses the capacitor (20) in a state wherein the two parallel flat surfaces (23) are disposed parallel to the parallel facing surface (51c), and the supporting member (50) is fixed to the cooler (40) in a state wherein the element unit (10) is pressed to the cooler (40) side by means of the parallel facing surface (51c).</p> |
