发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is sufficiently effective to improve resolution and resist stripping characteristics. <P>SOLUTION: The photosensitive resin composition contains: (A) a binder polymer having a structural unit based on styrene or a styrene derivative, a structural unit based on a benzyl (meth)acrylate or a benzyl (meth)acrylate derivative, a structural unit based on a (meth)acrylic acid, and a structural unit based on an alkyl ester (meth)acrylate, and having a dispersion degree of 1.0 to 2.0; (B) a photopolymerizable compound; and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012137768(A) 申请公布日期 2012.07.19
申请号 JP20120023401 申请日期 2012.02.06
申请人 HITACHI CHEM CO LTD 发明人 MIYASAKA MASAHIRO;MURAMATSU YUKIKO;NAMIKAWA HANAKO
分类号 G03F7/033;C08F2/44;C08F2/50;G03F7/004;G03F7/028;G03F7/029;H05K3/06;H05K3/18 主分类号 G03F7/033
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