发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is sufficiently effective to improve resolution and resist stripping characteristics. <P>SOLUTION: The photosensitive resin composition contains: (A) a binder polymer having a structural unit based on styrene or a styrene derivative, a structural unit based on a benzyl (meth)acrylate or a benzyl (meth)acrylate derivative, a structural unit based on a (meth)acrylic acid, and a structural unit based on an alkyl ester (meth)acrylate, and having a dispersion degree of 1.0 to 2.0; (B) a photopolymerizable compound; and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012137768(A) |
申请公布日期 |
2012.07.19 |
申请号 |
JP20120023401 |
申请日期 |
2012.02.06 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
MIYASAKA MASAHIRO;MURAMATSU YUKIKO;NAMIKAWA HANAKO |
分类号 |
G03F7/033;C08F2/44;C08F2/50;G03F7/004;G03F7/028;G03F7/029;H05K3/06;H05K3/18 |
主分类号 |
G03F7/033 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|