发明名称 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To irradiate approximately the same position with laser beams, at a temporal difference, while simply scanning a spot by a plurality of laser beams. <P>SOLUTION: A laser beam &lambda;a forms an image at an image-forming position P1a by a lens 120a, then is collimated by a lens 121a and enters a dual-wavelength mirror 123. A laser beam &lambda;b forms an image at an image-forming position P1b by a lens 120b, then is collimated by a lens 121b, reflected by a total reflection mirror 122, and enters the dual-wavelength mirror 123. The optical paths of the laser beam &lambda;a and the laser beam &lambda;b are joined together by the dual-wavelength mirror 123, and the laser beam&lambda;a and the laser beam&lambda;b form images at the image-forming positions P2a, P2b by a dual-wavelength lens 124. A module 131 for housing a total reflection mirror 119 and the lens 120b shifts in the direction orthogonal to the optical axis of the lens 120b by a shift mechanism 132. The present invention is applicable to, for example, a laser beam machining apparatus for machining a thin film solar cell panel. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012135808(A) 申请公布日期 2012.07.19
申请号 JP20100291337 申请日期 2010.12.27
申请人 OMRON CORP 发明人 KUDOKORO YUKIO;SUZUKI YOSHIKAZU
分类号 B23K26/04;B23K26/06;B23K26/067;B23K26/08 主分类号 B23K26/04
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