| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing material having a proper viscosity, and providing a cured product having a small linear thermal expansion coefficient, and to provide a semiconductor device sealed by using the semiconductor-sealing material. <P>SOLUTION: The semiconductor-sealing material contains an alicyclic epoxy compound A solid at 25°C, and having ≤1,000 of a molecular weight and two or more epoxy groups condensed with the ring, an alicyclic epoxy compound B liquid at 25°C, and having ≤1,000 of a molecular weight and two or more epoxy groups condensed with the ring, a curing agent liquid at 25°C, a curing accelerator and silica, regulated so that the ratio (alicyclic epoxy compound B/alicyclic epoxy compound A) of the content of the alicyclic epoxy compound B to the content of the alicyclic epoxy compound A by weight may be 0.5-2. The semiconductor device is sealed by using the semiconductor-sealing material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
