发明名称 SENSOR MODULE
摘要 A sensor module includes a sensor, a module cover, and a wiring unit. The cover holds the sensor and includes a connector configured to make a connection with an external device. The wiring unit is held by the cover and is arranged from the connector to the sensor. The wiring unit includes a connecting member extending from the connector to a central region of the cover in its width direction and a wiring member extending from the central region of the cover in its width direction to a vicinity of the sensor. The cover and the connecting member are integrally formed from a mold material having insulation properties. The connecting member includes a first connecting terminal exposed at the central region of the cover. The wiring member includes a second connecting terminal conductively joined to the first connecting terminal.
申请公布号 US2012181641(A1) 申请公布日期 2012.07.19
申请号 US201213348904 申请日期 2012.01.12
申请人 HIRAMOTO SATORU;KONO YOSHIYUKI;MIZUTANI AKITOSHI;KUBOTA TAKAMITSU;MATSUMOTO KOICHIRO;DENSO CORPORATION 发明人 HIRAMOTO SATORU;KONO YOSHIYUKI;MIZUTANI AKITOSHI;KUBOTA TAKAMITSU;MATSUMOTO KOICHIRO
分类号 H01L29/82 主分类号 H01L29/82
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