SUBSTRATE-PROCESSING DEVICE

摘要

[Problem] To make it possible to transfer substrates between single-wafer processing devices and batch processing devices continuously and efficiently, thereby improving the throughput of a combined single-wafer/batch process. [Solution] In this substrate-processing device, a processing station (10) is arranged in the center of the system such that the long axis (x-axis) thereof is horizontal, and a loader (12) and unloader (14) are connected to the lengthwise ends thereof. Said processing station (10) comprises the following, in the process-flow order from the loader (12) to the unloader (14): a single-wafer-only block (10A), a combined single-wafer/batch block (10B), and a single-wafer-only block (10C). The combined single-wafer/batch block (10B) in the middle is provided with: one or more single-wafer working-electrode film-formation units (36); one or more single-wafer grid-wiring film-formation units (38); a batch heat-treatment device (40); and a batch baking device (42).