| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat pipe type cooling apparatus of power converter, capable of achieving reductions in its size and weight by making temperatures of heat receiving members with a power semiconductor element on uniform. <P>SOLUTION: The cooling apparatus, which transmits the heat generated from a power element installed on a heat block surface to fins through a heat pipe and cools it by natural convection or forced convection of air running through between the fins, is structured so that a rising portion to the fin side of the heat pipe on the downstream side is disposed closer than that on the upstream side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
