| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing formation of a pattern excellent in mechanical characteristics. <P>SOLUTION: The photosensitive resin composition contains (A), (B1), (B2), (C) and (D) described in the following: (A) an alkali-soluble resin; (B1) a polymerizable compound including a cyclic ether structure with the carbon number 2-4 and an ethylenically unsaturated bond; (B2) a polymerizable compound different from (B1); (C) a polymerization initiator; and (D) a solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
