发明名称 Method of Fabricating Silicon Quantum Dot Layer and Device Manufactured Using the Same
摘要 Disclosed are a method of fabricating a silicon quantum dot layer and a device manufactured using the same. A first capping layer is formed on a substrate, and a silicon-containing precursor layer is formed on the first capping layer. A second capping layer is formed on the silicon-containing precursor layer. The first capping layer, the silicon-containing precursor layer, and the second capping layer are irradiated to convert the silicon-containing precursor layer into a stack including a first poly-crystalline silicon layer, a silicon quantum dot layer on the first poly-crystalline silicon layer, and a second poly-crystalline silicon layer on the silicon quantum dot layer.
申请公布号 US2012181503(A1) 申请公布日期 2012.07.19
申请号 US201113236439 申请日期 2011.09.19
申请人 LEE CZANG-HO;SEO JOON-YOUNG;KIM DONG-JIN 发明人 LEE CZANG-HO;SEO JOON-YOUNG;KIM DONG-JIN
分类号 H01L33/06;B82Y40/00;B82Y99/00;H01L21/20;H01L29/775;H01L33/08 主分类号 H01L33/06
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