| 摘要 |
<p>Provided is a method for processing a fragile material substrate that can carry out stable laser break processing. A method for processing a fragile material substrate comprises (a) an initial crack forming step of forming an initial crack on a scribe scheduled line adjacent to the edge of a first substrate, (b) a laser scribe step of relatively moving a beam spot of the first laser irradiation from the edge of the first substrate to the edge of a second substrate along the scribe scheduled line to heat the substrates, immediately cooling a portion where the beam spot has passed, and forming a scribe line with a limited depth along the scribe scheduled line by using a stress gradient in the depth direction caused in the scribe scheduled line, and (c) a laser break step of relatively moving a beam spot of the second laser irradiation from the edge of the second substrate to the edge of a first substrate along the scribe line in the reverse direction to make the scribe line penetrate further deeply or completely cuts off the scribe line.</p> |
