| 发明名称 |
SEMICONDUCTOR DIE ATTACHMENT FOR HIGH VACUUM TUBES |
| 摘要 |
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom. |
| 申请公布号 |
EP1907159(A4) |
申请公布日期 |
2012.07.18 |
| 申请号 |
EP20060788144 |
申请日期 |
2006.07.21 |
| 申请人 |
INTEVAC, INC. |
发明人 |
COSTELLO, KENNETH, A. |
| 分类号 |
H01L23/24;B23K1/00;B23K5/00;B23K31/02;H01J31/26;H01L21/60;H01L23/053;H01L23/22;H01L27/146;H01L31/00 |
主分类号 |
H01L23/24 |
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