发明名称 |
SEMICONDUCTOR CHIP WITH STAIR ARRANGEMENT BUMP STRUCTURES |
摘要 |
Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads. |
申请公布号 |
EP2476135(A1) |
申请公布日期 |
2012.07.18 |
申请号 |
EP20100814842 |
申请日期 |
2010.09.09 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
TOPACIO, RODEN R.;LOW, YIP SENG |
分类号 |
H01L23/485;H01L21/60 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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